Circuit Board - induction heating machine manufacturer

Induction RF Soldering Circuit Board With High Frequency Soldering Heater

Objective Heat a circuit board assembly to 600ºF (315.5ºC) to solder RF connectors to a radar manifold.
Material Kovar connectors 0.100” (2.54mm) wide x 0.200” (5.08mm) long, circuit board and solder paste
Temperature 600ºF (315.5ºC)
Frequency 271 kHz
Equipment • DW-UHF-2 kW induction heating system, equipped with a remote workhead containing one 1.2μF capacitor.
• An induction heating coil designed and developed specifically for this application.
Process A two turn helical coil is used to heat the assembly. Solder paste is applied to the joint area, the connectors are placed in the proper location and heat is applied for 10 seconds, creating
the solder paste to flow.
Results/Benefits Induction heating provides:
• Creates liquid and gas-tight joint quickly and efficiently
• Precise application of heat without affecting others areas of board
• Hands-free heating that involves no operator skill for manufacturing
• Even distribution of heating

Induction Soldering Circuit Board With IGBT heating system

Objective To heat post, lead or lead-free solder preforms for various circuit board soldering applications.
Material Upper and lower circuit boards, small and large lead or lead free preforms.
Temperature < 700 ºF (371ºC) depending on the preform used
Frequency Three turn coil 364 kHz
Small two turn coil 400 kHz
Large two turn coil 350 kHz
Equipment • DW-UHF-4.5 kW induction heating system, equipped with a remote workhead containing two 0.66μF capacitors for a total of 1.32 μF
• An induction heating coil, designed and developed specifically for this application.
Process Three individual coils are used to heat the various locations on the circuit board depending upon if the location is a single application or a group application. The time varies from 1.8 to 7.5 seconds depending upon location. In production the heat stations and coils are moved into position over the post for automation purposes. Either lead or lead free solder preforms are used. The process time on the lead free solder is slightly longer.
Results/Benefits Induction heating provides:
• Hands-free heating that involves no operator skill for manufacturing, lends itself well to automation.
• Solder controlled by preforms, no excess left on board.
• Good solder flow without over heating the board and damaging adjacent circuits and components.