Induction Soldering Circuit Board With IGBT heating system
Objective To heat post, lead or lead-free solder preforms for variousĀ circuit board soldering applications.
Material Upper and lower circuit boards, small and large lead or leadĀ free preforms.
Temperature < 700 ĀŗF (371ĀŗC) depending on the preform used
Frequency Three turn coil 364 kHz
Small two turn coil 400 kHz
Large two turn coil 350 kHz
Equipment ā¢ DW-UHF-4.5Ā kW induction heating system, equipped with aĀ remote workhead containing two 0.66Ī¼F capacitors for aĀ total of 1.32 Ī¼F
ā¢ An induction heating coil, designed and developedĀ specifically for this application.
Process Three individual coils are used to heat the various locations onĀ the circuit board depending upon if the location is a singleĀ application or a group application. The time varies from 1.8 toĀ 7.5 seconds depending upon location. In production the heatĀ stations and coils are moved into position over the post forĀ automation purposes. Either lead or lead free solder preformsĀ are used. The process time on the lead free solder is slightlyĀ longer.
Results/Benefits Induction heating provides:
ā¢ Hands-free heating that involves no operator skill forĀ manufacturing, lends itself well to automation.
ā¢ Solder controlled by preforms, no excess left on board.
ā¢ Good solder flow without over heating the board andĀ damaging adjacent circuits and components.
