Induction Soldering Circuit Board With IGBT heating system
Objective To heat post, lead or lead-free solder preforms for variousย circuit board soldering applications.
Material Upper and lower circuit boards, small and large lead or leadย free preforms.
Temperature < 700 ยบF (371ยบC) depending on the preform used
Frequency Three turn coil 364 kHz
Small two turn coil 400 kHz
Large two turn coil 350 kHz
Equipment โข DW-UHF-4.5ย kW induction heating system, equipped with aย remote workhead containing two 0.66ฮผF capacitors for aย total of 1.32 ฮผF
โข An induction heating coil, designed and developedย specifically for this application.
Process Three individual coils are used to heat the various locations onย the circuit board depending upon if the location is a singleย application or a group application. The time varies from 1.8 toย 7.5 seconds depending upon location. In production the heatย stations and coils are moved into position over the post forย automation purposes. Either lead or lead free solder preformsย are used. The process time on the lead free solder is slightlyย longer.
Results/Benefits Induction heating provides:
โข Hands-free heating that involves no operator skill forย manufacturing, lends itself well to automation.
โข Solder controlled by preforms, no excess left on board.
โข Good solder flow without over heating the board andย damaging adjacent circuits and components.
