Induction RF Soldering Circuit Board With High Frequency Soldering Heater
Objective Heat a circuit board assembly to 600ยบF (315.5ยบC) to solder RFย connectors to a radar manifold.
Material Kovar connectors 0.100โ (2.54mm) wide x 0.200โ (5.08mm)ย long, circuit board and solder paste
Temperature 600ยบF (315.5ยบC)
Frequency 271 kHz
Equipment โข DW-UHF-2ย kW induction heating system, equipped with aย remote workhead containing one 1.2ฮผF capacitor.
โข An induction heating coil designed and developedย specifically for this application.
Process A two turn helical coil is used to heat the assembly. Solderย paste is applied to the joint area, the connectors are placed inย the proper location and heat is applied for 10 seconds, creating
the solder paste to flow.
Results/Benefits Induction heating provides:
โข Creates liquid and gas-tight joint quickly and efficiently
โข Precise application of heat without affecting others areas ofย board
โข Hands-free heating that involves no operator skill forย manufacturing
โข Even distribution of heating
